2018-12-12, 周三
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学术动态

Braham Ferreira:Better packaging, integration and manufacturing concepts for power electronics

报告时间:2018年8月23日(星期四) 下午2:45

报告地点:逸夫楼1117

:Prof. Braham Ferreira

工作单位:Delft University of Technology

举办单位:电气与自动化工程学院

报告人简介

 

Braham Ferreira,荷兰代尔夫特理工大学电力电子与电机驱动专业教授、博士生导师、IEEE Fellow。2006-2010担任代尔夫特理工大学电气与新能源学院院长,2014-2016年担任IEEE电力电子协会(PELS)主席,现任IEEE国际宽禁带半导体技术路线图委员会(ITRW) 主席, 欧洲电力电子中心(ECPE)顾问,代尔夫特理工大学北京研究院院长。IEEE 工业应用协会“ IAS 杰出贡献奖”,“Gerald Kliman Innovator” 等获得者,发表100余篇国际期刊、专利,其中16次获得最佳论文。

报告简介

Power Electronics inherited the circuit assembly technology that established itself in the 1960s and 1970s to build analogue circuits on printed circuit boards using discrete components. At low power levels the converters can conveniently be built on a single PCBs, and at large power levels, multiple of PCBs are used while semiconductor switches and passive components get individual mechanical assemblies. This method of building power electronics has been improved and adapted through the years, but has not changed much.

In view of the growing market, large production and the demand for more miniaturization and higher performance, enough incentives exist to reinvent the methods for manufacturing and assembling power electronic converters. A three prong approach is possible:

  • Reduce the number of physical components by using multifunctional parts,
  • Increase the levels on integration,
  • Adapt the assembly technology and component designs to automated production of power electronic circuits possible.